Benoit,
I would check your sputter chamber for leaks. If there is a leak, it is
possible you get Cr oxides during deposition. These oxides will dissolve
in concentrated HF causing the bond pads to fall apart.

Best regards,
Michael Pedersen
--
MEMS-Exchange
Corporation for National Research Initiatives
1895 Preston White Drive, Ste. 100
Reston, VA 20191-5434

Phone:  703-262-5342
Fax:    703-262-5367
e-mail: [email protected]
Please visit us @: www.mems-exchange.org

Benoît GAULIER wrote:
> Dear Colleagues,
>
> Am searching for practical information / experience on sputtering
metallization.
> I'm using SOI wafers and i tried to have Cr/Pt/Au contacts on Si. After
> sputtering, I did a post bake and I had a long HF 48% attack. It look like an
> etch under contacts.
> Does anybody know this problem and how to avoid it?
> Any experiences, information, recipes, etc would be greatly appreciated.
>
> Best regards,
>
> Benoît GAULIER.