A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: RE: GLASS FRIT BONDING PIEZORESISTIVE SEMICONDUCTOR
RE: GLASS FRIT BONDING PIEZORESISTIVE SEMICONDUCTOR
2003-02-10
Gabriel, Markus
RE: GLASS FRIT BONDING PIEZORESISTIVE SEMICONDUCTOR
Gabriel, Markus
2003-02-10
Graham,

we can offer you our help as we have a lot of experience in all wafer
bonding processes.


Markus.


SUSS MicroTec
Business Field MEMS
Markus Gabriel
Schleissheimer Str. 90
85748 Garching
Germany
Fon     +49 89 32007 - 313
Fax     +49 89 32007 - 390
email   [email protected]
  http://www.suss.com/mems
------------------------------

-----Original Message-----
From: Graham Tomblin [  
mailto:[email protected]]
Sent: Tuesday, February 04, 2003 11:38 AM
To: [email protected]
Subject: [mems-talk] GLASS FRIT BONDING PIEZORESISTIVE SEMICONDUCTOR
GAGES TOST ST


Does anyone know of a technique for bonding piezo-resistive strain gages =
to=20
stainless steel using glass frit?.
Types of glass, gages, wire bonds and process definition  would be a =
great help.
Regards
 Graham

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Tanner EDA by Mentor Graphics
University Wafer
The Branford Group
MEMS Technology Review