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MEMSnet Home: MEMS-Talk: 8. RE: Anodic bonding SOI wafer and glass
8. RE: Anodic bonding SOI wafer and glass
2003-02-18
Hell, Erwin
8. RE: Anodic bonding SOI wafer and glass
Hell, Erwin
2003-02-18
We building bonding machines and we have experience over 10 years. We have
bonded samples like that with different thickness of oxid and the result was
to customers satisfaction. If you would be interested in testing same sample
material don't hesitate to contact me by email or phone.

Mit freundlichen Gruessen,
Yours sincerely,
------------------------------------------------------------------
SUSS MicroTec
Hell Erwin
Product Specialist
Aligner & Bond Systems
Schleissheimerstr.90
D-85748 Garching
Germany
**********************************
Tel.    +49 (0) 89 32007 307
Fax.    +49 (0) 89 32007 162
Cell:   +49 (0) 170 5386531
Email:  hell@suss.de
Int:    http://www.suss.com

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