Hi all,
as far as for the wet etching, you can us TMAH doped
with silicon. IT works quite OK assuming that the
aluminum is thick enough and not in any connection
with the substrate. Otherwise you get electrochemical
corrosion of the ground and VDD bond pad. The solution
also not that stable and it is sometimes matter of
luck, if it will work or not.
In case you can use dry etching with no preference in
directionality, the XeF2 is the best bet. If you wish
to test your sample, you can send us your wafer and we
will etch them for you. As simple as that. The
turnaround is approximately one week plus shipping
delay. A few wafers are assumed to be samples and we
will do it free of charge. Either email me at
[email protected] or have a look at the system at the
web site: http://www.pentavacuum.com/mems.htm
Pavel


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Sunil,
Thanks a lot.
But I am wondering some Si Etchant(eg. KOH, TMAH)
which will not attack SiO2 and Al. Sorry about the
confusing.
Johnny


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