I have anodically bonded Pyrex to silicon wafers with several thousand
Angstroms of oxide.  I've also anodically bonded Pyrex to a 6000 Angstroms
film of Silicon Nitride.

Before bonding to the nitride it must be "annealed" in wet oxygen at 1100
degC for 4 hours (sounds like oxidation to me).  The bonding, is then done
for 4 hours at 400 degC with -400 volts applied to the Pyrex.

 My understanding is that the surface to which the Pyrex is bonded must be
oxidized.  Pyrex or other glass containing mobile ions can be anodically
bonded to silicon or to metals that oxidize, such as Al, but not to metals
that don;t oxidize such as Au.

Roger Shile

----- Original Message -----
From: "Hell, Erwin" 
To: 
Sent: Monday, March 17, 2003 6:20 AM
Subject: [mems-talk] dielectric layer


> Hi all,
> does anyone has experience/knowledge about anodic bonding with a
dielectric
> layer between  glass and silicon? How does it affect the bond quality?
>
> Any recommendations are appreciated
>
> ------------------------------------------------------------------
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