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  • patterning of PZT (cgorecki)
  • SU-8 Adhesion (Ruggiero, Dara)
  • why there will be a 54.7 degrees when wet etching a silicon wafer with KOH (Oscar Hui)
  • Hot Embossing (Emer O'Reilly)
  • BCB properties (Alireza Modafe)
  • ultimate strain? (Daniel T. Wolters)
  • Ion Milling on 4" wafers (Thomas Wendling)
  • Open MEMS positions in Sunnyvale, CA (S. Kollengode)
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