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  • Electroplating Nickel (zhenfang chen)
  • Mini Compressor (Niels Olij)
  • Visit to the Library (Kevin Banks)
  • MEMS acoustic transducers (Meadowcroft, Jonnie)
  • electrostatic pull-in voltage for cantilever beam (Paolo Bondavalli)
  • Electroplating Gold (Sonia Garcia Blanco)
  • Re: MEMS acoustic transducers (Thomas B. Jones)
  • electrostatic pull-in voltage for cantilever beam (Babu(Panduga))
  • measurement of sidewall roughness (Vic Kley)
  • How to prevent the ethant from creeping along the interface between photoresist and semiconductor material? (Michael Yakimov)
  • Vacuum Technology Products (Trevor MacCrae, KVT)
  • NEMS oscillators (Tim E. Harper)
  • Re: Electrostatic pull-in voltage for cantilever (Craig McGray)
  • Re: Electroplating Gold (Jordan M. Berg)
  • Electroplating Gold (Walter Stonas)
  • MEMS acoustic transducers (Ravi Shankar)
  • micropower source (Andrew F Rutkiewic)
  • any method to measure residul stress in bonding membrane (li shifeng)
  • Electroplating Gold (Yohannes M Desta)
  • NEMS oscillators (Anatoli Olkhovets)
  • Teflon foil. (Nathalia)
  • How to prevent the ethant from creeping along the interface between photoresist and semiconductor material? (Qingwei Mo)
  • any method to measure residul stress in bonding membrane (Karl Cazzini)
  • electrostatic pull-in voltage for cantilever beam (Zhang Xuming)
  • NEMS oscillators (Zhang Xuming)
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