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  • Teflon coated pyrex glass wafer bonding (kumar m.v.n buduri)
  • Fluidic Packaging (Knut Lian)
  • Teflon foil (Michal Dalog)
  • Anodic bonding glass-titanium (Niels Olij)
  • quarts wafers (Nir Pernat)
  • EPI layer Etching (aslam muhammad)
  • Plasm-therm RIE temperature ([email protected])
  • silicon 'rounding' etch (Jim Beall)
  • Pt deposition on glass or silicon (Hongjun Zeng)
  • EPI layer Etching (Kenneth Smith)
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