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  • High temperature - Solution with Diamond MEMS ? (Ertl, Stephan)
  • a-Si Etch Rate in Nitrogen-RIE (Ertl, Stephan)
  • microphone testing (Wieslaw Bicz)
  • DRIE of quartz (BURRI Mathieu)
  • DRIE of quartz (Heiko van der Linden)
  • Thermal expansion coefficient of oxide film (Jia Zhou)
  • Wafer Drying (Roger Brennan)
  • Rebuilding a Reactive Ion Etcher (RIE). (Roger Brennan)
  • Lift-off of AZ5214 (Bill Moffat)
  • Wafer Drying (Bill Moffat)
  • Wafer Drying ([email protected])
  • Rebuilding a Reactive Ion Etcher (RIE). ([email protected])
  • Wafer Drying (Mark West)
  • meshing from GDS II (Michael D Martin)
  • [Q]surface cleaning (SOOJIN OH)
  • Re: Thermal expansion coefficient of oxide film (Jia Zhou) (YI ZHOU)
  • Re: Thermal expansion coefficient of oxide film (Craig McGray)
  • Rebuilding a Reactive Ion Etcher (RIE). (Michael D Martin)
  • The thin plastic wafers(thickness<200um) is needed!! (Zhu, Xiaoshan)
  • Oxidation question (Ranju Arya)
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