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  • Thick Photoresist Materials/Applications (BERAUER,FRANK (HP-Singapore,ex7))
  • Adhesion layer for Pt films (high temp application) (shay kaplan)
  • how to etch SiO2 with RIE (Ravi Shankar)
  • PDMS (Greg Miller)
  • How to remove residual SiNx ? ([email protected])
  • Regarding the dry selective and isotropic etch for III-V ([email protected])
  • Anodic Bonding of Si to Pyrex (Connie Kathleen Smith)
  • GLASS FRIT (Paolo Bondavalli)
  • Anodic Bonding of Si to Pyrex (Klauder, Jr., Philip R.)
  • Anodic Bonding of Si to Pyrex (Mac McReynolds)
  • GLASS FRIT (Liz Shelley)
  • Conductive bonding techniques in silicon (Richard Morrison)
  • Conductive bonding techniques in silicon ([email protected])
  • Anodic Bonding of Si to Pyrex (allen kine)
  • Thick Photoresist Materials/Applications (Andrew Kuchling)
  • Anodic Bonding of Si to Pyrex (Palensky Joshua)
  • GLASS FRIT (Bill Moffat)
  • In/Ga eutectoid vendor. Anybody knows? (Gang Zhang)
  • PDMS (Po-Hao A. Huang)
  • In/Ga eutectoid vendor. Anybody knows? (Maurice Norcott)
  • Regarding the dry selective and isotropic etch for GaAs (Gordon Whitlock)
  • In/Ga eutectoid vendor. Anybody knows? (Nickolay V. Lavrik)
  • GLASS FRIT (RobDavis)
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