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  • Measure polydepletion thickness (by calculation) and boron penetr ation (CHEW SOON AIK)
  • Etchant infromation (mikoyan)
  • Summary on responses to Si/SiO2 KOH etching selectivity (Yanjun(David) Tang)
  • Looking for component level high vacuum(1mtorr to 5 mtorr) package sealing (Lucy Huang)
  • SiO2:Si3N4 etch selectivity in HF (bille@npphotonics (Bill Eaton))
  • SiO2:Si3N4 etch selectivity in HF ([email protected])
  • Jobs in instrumentation/automation (Fussell, Ellen)
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