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  • Polymber molding (Yanjun(David) Tang)
  • adhesion of PECVD SiN or SiO2 to electroplated gold (Oberhammer Joachim)
  • Electron beam lithography with a filament SEM (Francois MONTAIGNE)
  • 1 micron thick low stress nitrides? (Mighty Platypus)
  • measuring thickness of thin organic layers (Madanagopal K.V.)
  • 1 micron thick low stress nitrides? (bille@npphotonics (Bill Eaton))
  • 1 micron thick low stress nitrides? ([email protected])
  • 3-dimensional diffusion model (Qintao Zhang)
  • some doubts about MEMS (Cesare)
  • 3-dimensional diffusion model (Josef Kouba)
  • 1 micron thick low stress nitrides? (Michael D Martin)
  • 1 micron thick low stress nitrides? ([email protected])
  • Coating Vendors (Michael D Martin)
  • some doubts about MEMS (Summers, Jeff)
  • Bonding material impervious to KOH bath (Michael D Martin)
  • Bonding material impervious to KOH bath (David Nemeth)
  • MUMPs Modeling Software (Robert Johnstone)
  • 1 micron thick low stress nitrides? ([email protected])
  • Bonding material impervious to KOH bath ([email protected])
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