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  • Etch dry oxide (Sungjun Lee)
  • Open MEMS modules (Edward Principe)
  • AZ 9260-100 micron thick resist (martin thornton)
  • pyrex 7740 (Ravi Shankar)
  • about growth of SiN layer on porous silicon? (高 晓童)
  • Overlay between front and back of wafer (Mark van der Heijden)
  • Overlay between front and back of wafer (Luesebrink Helge)
  • about growth of SiN layer on porous silicon? (Marc Christophersen)
  • Overlay between front and back of wafer (Shay Kaplan)
  • Alternative to wet etching for glass (Haigh, Richard)
  • AZ 9260-100 micron thick resist (Neal Ricks)
  • Overlay between front and back of wafer (Roger Brennan)
  • AZ 9260-100 micron thick resist (scotttb@umich.edu)
  • contamination risks with spin on dopant? (Aaron Glatzer)
  • contamination risks with spin on dopant? (fwd) (Aaron Glatzer)
  • bridging (Jakob Christoph)
  • pyrex 7740 (Jesse Moreland)
  • Etching another microchannel on a facet of a largerexistingmicrochannel (Michael D Martin)
  • Etch dry oxide (Craig McGray)
  • pyrex 7740 (Susan Coder)
  • Overlay between front and back of wafer (Brubaker Chad)
  • measuring overvolatage (IGOR KADIJA)
  • pyrex 7740 (sp)
  • Removal of Pt black? (Alik Widge)
  • Balzer BAS 450 (R. Brent Garber) (2 parts)
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