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  • material thermal and electrical properties (Sebastian Sosin)
  • Re: SiO2 on GaAs by ebeam evaporator (DARREN S GRAY)
  • SOG for wafer bonding (Zhimin J Yao)
  • Low stress thermal oxide? Tensile stress? (Zhimin J Yao)
  • Micro-heater in a channel? (Zhizhong Yin)
  • RE: DRIE sidewall angle (Johnston, Ian)
  • Anisotropic Silicon Dioxide Reactive Ion Etching (frank berisford)
  • Re: SiO2 on GaAs by ebeam evaporator (Philip D. Floyd)
  • questions for Tungsten on BCB (hzhu5@imap2.asu.edu)
  • SiO2 on GaAs by ebeam evaporator (Brent Garber) (2 parts)
  • Anisotropic Silicon Dioxide Reactive Ion Etching (Isaac Wing Tak Chan)
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