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  • PDMS to metal bond and corona discharge (Michael D Martin)
  • Ansys Initial stress problem (rakesh babu)
  • working without clean room (Patrick Roman)
  • how to bond silicon wafer to stainless steel? (Brubaker Chad)
  • Pyrex CTE at 500C (Paul Elliott)
  • Etching copper in ferric chloride (Leidong Mao)
  • Oxide Release - Etch Holes (Kishore Sundara-Rajan)
  • Etching copper in ferric chloride (Jauniskis, Linas)
  • Oxide Release - Etch Holes (Phillipe Tabada)
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