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trans126 element in ansys (RaviKumar MTech IIT Kanpur)
Re: Au Thickness vs. Conductivity (Harald Walter)
Removing gold , plated on GaAs (
[email protected]
)
Sputtered Cr-Au layer resistance against HF (Paolo Tassini)
Sputtered Cr-Au layer resistance against HF (Borski, Justin)
Sputtered Cr-Au layer resistance against HF (Brent Garber)
Sputtered Cr-Au layer resistance against HF (
[email protected]
)
Sputtered Cr-Au layer resistance against HF (
[email protected]
)
residues on RIE etched sio2 (yilei zhang)
reg: spin on glass (Krishna Vummidi)
Underetching/Lift-off of Au features during Cr etch (Brian Dick)
SU-8 on 6 inch wafers & PDMS casting trays (Dwayne Dunaway)
Underetching/Lift-off of Au features during Cr etch (Kirt Williams)
SU-8 on 6 inch wafers & PDMS casting trays (Lee Pang)
SU-8 on 6 inch wafers & PDMS casting (Dwayne Dunaway)
SU-8 on 6 inch wafers & PDMS casting trays (Brubaker Chad)
residues on RIE etched sio2 (Isaac Wing Tak Chan)
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