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  • low viscosity epoxy (oray orkun cellek)
  • Thermocoupler for Rapid Thermal Annealing (René Fléron)
  • Visit to the Library (Jean Podlecki)
  • wet etchant of Silicon with etch rate in few nm/m in (kirt_williams@agilent.com)
  • measurement of sidewall roughness (Rod Ruoff)
  • Thin PMMA layer (Matthias Kruse)
  • wet etchant of Silicon with etch rate in few nm/min (Bernard Legrand)
  • metal resistant to HCl:HNO3 (Rivas, Isabel)
  • measurement of sidewall roughness (Vic Kley)
  • low viscosity epoxy (Karl Cazzini)
  • metal resistant to HCl:HNO3 (David Nemeth)
  • measurement of sidewall roughness (Vic Kley)
  • Thin PMMA layer (Karl Cazzini)
  • low viscosity epoxy (Maurice Norcott)
  • metal resistant to HCl:HNO3 (Liz Shelley)
  • Equipment for formation of porous silicon (Vidya Sagar)
  • palladium etching (Xing Yang)
  • How to prevent the ethant from creeping along the interface between photoresist and semiconductor material? (Qingwei Mo)
  • measurement of sidewall roughness (Fabrice Morin)
  • Looking for information about mems packaging (jvidal@uaeh.reduaeh.mx)
  • electrostatic pull-in voltage for cantilever beam (LEOW Cheah Wei)
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