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  • Gold film (Gurvinderjit Singh)
  • Highest resistivity silicon? (Fred Hussain)
  • DRIE etching of bulk silicon (Martin.WALKER@oxinst.co.uk)
  • PDMS pillar shape (Bill Moffat)
  • Adhesion layers that can withstand a 3 hour HF release (Mehmet R. Dokmeci)
  • Highest resistivity silicon? (Michael Pedersen)
  • Highest resistivity silicon? (David Nemeth)
  • RE: mems-talk digest, Vol 1 #291 - 7 msgs (Marc Straub)
  • Highest resistivity silicon? (Michael Barger)
  • PDMS pillar shape (mmf)
  • Wet etching TiW (Guangqing Meng)
  • Highest resistivity silicon? (Kenneth Smith)
  • Cu-Ni alloy sputtering (Kit Sunder)
  • any MEMS group in Los Angeles area? (Badakhshan, Al)
  • Wet etching TiW (Charles Ellis)
  • Gold film (___)
  • Highest resistivity silicon? (Michael D Martin)
  • Trench Filling (Sanghoon Lee)
  • Highest resistivity silicon? (Kenneth Smith)
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