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  • RE: fluorocarbon residue removal in silicon DRIE (Marc A F van den Boogaart)
  • not the usual question (Kris Armoogum)
  • SIN etching (Mark Schvartzman)
  • acheiving a uniform sacrificial layer profile? (Michael Yakimov)
  • doping effects in Si etching (BobHendu@aol.com)
  • doping effects in Si etching (MARGOLLE Arnaud)
  • nano-beads (Christopher F. Blanford)
  • Deep trenches filling (qwer 1234)
  • RE: shear modulus of nickel (Yanjun(David) Tang)
  • releasing nickel nanowires??? (pm72)
  • PLASMA CHARGE DAMAGE to CMOS/MEMS? (Bill Moffat)
  • releasing nickel nanowires??? (Shimin Xu)
  • PLASMA CHARGE DAMAGE to CMOS/MEMS? (phil.lau@baesystems.com)
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